Sharp Develops and Introduces New Solar Module for Mobile Devices with Thickness of 0.8 mm, the Industry's Thinnest
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Sharp Develops and Introduces New Solar Module for Mobile Devices with Thickness of 0.8 mm, the Industry's Thinnest - JCN Newswire
Sharp Develops and Introduces New Solar Module for Mobile Devices with Thickness of 0.8 mm, the Industry's Thinnest

 Sharp Develops and Introduces New Solar Module for Mobile Devices with Thickness of 0.8 mm
Tokyo, May 26, 2009 - (JCN Newswire) - Sharp Corporation has developed and will introduce into the global market the new LR0GC02 Solar Module for Mobile Devices that features a thickness of 0.8 mm, the industry's thinnest level.

Solar (photovoltaic) power generation is drawing attention worldwide as environmentally friendly clean energy, and is expected to see widespread use not only for residential use, but also to power mobile devices.

This newly developed solar module makes effective use of compact semiconductor packaging technology to achieve a thickness of just 0.8 mm, the thinnest level in the industry. The solar cells that make up the module are based on polycrystalline silicon and deliver a maximum power of 300 mW(1), and as an auxiliary power source for mobile devices, will contribute to saving energy. In addition, the electrode pattern on the cell surface can be formed to meet the requirements of device manufacturers, leading to increased design flexibility for mobile devices.

As an environmentally advanced company, Sharp is actively working to promote the development of environmentally conscious, one-of-a-kind devices and modules.

Product name Solar module for mobile devices
Model name                    LR0GC02
Sample price (tax included)   3,000 yen
Sample availability           May 26, 2009
Mass production start         July 10, 2009
Monthly production            100,000 units
Major Features

1. Makes effective use of compact semiconductor packaging technology to achieve a thickness of just 0.8 mm, the industrys thinnest level.
2. Solar cells use polycrystalline silicon, and deliver a maximum power of 300 mW(1).
3. Electrode pattern can be formed on the cell surface to meet the requirements of the device manufacturer, enabling the creation of modules with original designs

Specifications
Parameter                     Value
Power output (max.)           300 mW (typ.)
Output voltage (max.)         4.5 V (typ.)
Load current (max.)           67 mA (typ.)
Dimensions                    67.5 x 41.0 x 0.8 mm
(1) Measurement conditionsair mass (AM) 1.5 spectra; irradiance: 1,000 W/m2 +/-50 mW; module temperature: 25 C.


About Sharp

Sharp Corporation (TSE: 6753) is a worldwide developer of innovative products and core technologies that play a key role in shaping the future of electronics. As a leader in liquid crystal displays (LCDs) and digital technologies, Sharp offers one of the broadest and most advanced lines of consumer electronics, information products and electronic components, while also creating new network businesses. For more information, please visit www.sharp.co.jp .



Contact:

Public Relations Division
 http://sharp-world.com/index.html
+81-6-6621-1272
 

May 26, 2009
Source: Sharp

Sharp (TSE: 6753) (U.S: SHCAY)

From the Japan Corporate News Network
http://www.japancorp.net
Topic: Press release summary
View more news from these Sectors: Energy, Telecoms


 
 
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