Tokyo, Sept 16, 2009 (IRG) - TDK Corp. has come up with a silicon wafer conveyor compatible with next-generation semiconductors featuring 22-nanometer line widths. Conveyors are the part of semiconductor manufacturing systems that carry wafers to and from the chipmaking apparatus.
TDK analyzed the airflow patterns and placed slits near the bottom surface of the conveyor where the flow is stagnant to ensure that the air exits the system smoothly. By controlling the airflow around the conveyor, the company reduced the volume of dust particles measuring 60-100nm in diameter by 30-40. Such particles can cause problems when fabricating semiconductors in the 22nm mode.
The new product will cost around 1 million yen (US$11,000), which is around 10 percent less than current offerings, thanks to a reduction in the number of parts and other cost-control efforts. Mass production at a rate of 100 units a month will begin this month.
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