Tokyo, Dec 10, 2004 (JCN) - Panasonic SC Device Solutions Co., Ltd. (PSCDS), a subsidiary of Matsushita Electric Industrial Co., Ltd. (TSE: 6752), has recently announced the development of a 3-megapixel camera module designed for mobile phones.
With the latest v Maicovicon image sensor at the core, the module, GP-KM3500V, incorporates auto-focusing and image-stabilizing capabilities in the industry's thinnest 8.63mm package. The GP-KM3500V makes camera phones thinner while ensuring superb picture quality.
In order to achieve the compact camera module, PSCDS integrated the sensor, an imaging digital signal processor (DSP), and the lens unit with an infra-red (IR) filter, in a three-dimensional electronic circuit board using Molded Interconnect Device (MID) technology. This integration allows high quality pictures with reduced ghosts and flares in the industry's thinnest camera module.
The high-resolution DSP was specifically designed for camera phones to optimize the performance of the new 3-megapixel image sensor. The chip delivers clear, vivid still pictures as well as corrects blurry images caused by camera-shake. The image stabilizer functions when taking video at a full rate of 30 frames per second at VGA resolution. The chip also controls the mechanical shutter and strobe. It is the result of Panasonic's expertise and experience in imaging technology.
Along with the 3-megapixel (1/3.2-inch optical format) module, Panasonic announced two new imaging modules: the 2-megapixel (1/3.2-inch optical format) camera module with auto-focus and the 1.3-megapixel (1/4-inch optical format) camera module with built-in macro zooming function.
The company plans to start volume production of the 3-megapixel and 2-megapixel modules in March 2005 and 1.3-megapixel module in January 2005.
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