Hitachi Chemical and A*STAR'S IME to Develop 3D IC Technologies
Tokyo, Aug 29, 2012 (JCN) - Hitachi Chemical and A*STAR's Institute of Microelectronics (IME) will collaborate on research into high performance material technologies to support thin wafer processing for 3 dimensional integrated circuit (3D IC) packaging.
Hitachi Chemical will leverage IME's advanced 3D IC process capabilities to enhance material technologies that can support the demanding requirements of thin wafer processing and enable the industry to move to high-volume production of 3D ICs.
This innovative research will improve productivity of 3D ICs, to be used in mobile handsets, computers, gaming platforms, wireless and wired communication equipment, cameras, automobiles and aerospace applications.
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