http://www.japancorp.netJCN Newswire - Recent Headline Newsen-usCopyright 2012, JCN Newswire10http://www.japancorp.net/images/jcnxml.jpghttp://www.japancorp.net8831JCN Newswirehttp://www.japancorp.net/press_release/24807/sonys_clefia_adopted_as_an_international_standard_in_lightweight_cryptographyhttp://www.japancorp.net/press_release/24807/sonys_clefia_adopted_as_an_international_standard_in_lightweight_cryptographySony CLEFIA block cipher algorithm has been adopted as one of the ISO/IEC 29192 International Standards in lightweight cryptography after the final approval of ISO/IEC.Tue,31 Jan 2012 12:48:18 +0000http://www.japancorp.net/press_release/24800/sanyo_files_patent_infringement_suit_against_sharphttp://www.japancorp.net/press_release/24800/sanyo_files_patent_infringement_suit_against_sharpSANYO has filed patent infringement lawsuits against Sharp, seeking permanent injunctions and compensatory damages for the LCD modules of televisions and mobile phones manufactured and sold by Sharp based on four LCD-related patents owned by SANYO.Mon,30 Jan 2012 13:59:36 +0000http://www.japancorp.net/press_release/24788/asahi_kasei_microdevices_develops_6axis_electronic_compass_for_portable_electronicshttp://www.japancorp.net/press_release/24788/asahi_kasei_microdevices_develops_6axis_electronic_compass_for_portable_electronicsAsahi Kasei Microdevices' AK8978 is a 6-axis electronic compass for portable electronics such as mobile phones, smartphones and tablet devices.Fri,27 Jan 2012 13:07:42 +0000http://www.japancorp.net/press_release/24784/kddi_to_commence_mobile_nfc_serviceshttp://www.japancorp.net/press_release/24784/kddi_to_commence_mobile_nfc_servicesKDDI will begin unrolling its mobile NFC (Type A/B) services from late January 2012.Thu,26 Jan 2012 20:03:13 +0000http://www.japancorp.net/press_release/24761/toshiba_to_supply_steam_turbinegenerators_for_holcomb_expansion_project_in_the_ushttp://www.japancorp.net/press_release/24761/toshiba_to_supply_steam_turbinegenerators_for_holcomb_expansion_project_in_the_usToshiba has won a major contract to supply a 971MW supercritical steam turbine and generator for the Holcomb Thermal Power Plant in Kansas, USA.Fri,20 Jan 2012 12:26:16 +0000http://www.japancorp.net/press_release/24740/asahi_kasei_acquires_crystal_ishttp://www.japancorp.net/press_release/24740/asahi_kasei_acquires_crystal_isThe acquisition facilitates the full combination of Asahi Kasei and CIS's technologies, marking Asahi Kasei's entry into the highly promising UV LED market, and providing a foundation for further development in the field of energy-conserving devices.Tue,17 Jan 2012 13:58:25 +0000http://www.japancorp.net/press_release/24702/toshiba_slc_nand_flash_memory_features_embedded_ecchttp://www.japancorp.net/press_release/24702/toshiba_slc_nand_flash_memory_features_embedded_eccToshiba's BENAND is a versatile, multi-application single level cell (SLC) NAND flash memory that features an embedded error correction code (ECC).Mon,9 Jan 2012 09:56:29 +0000http://www.japancorp.net/press_release/24696/cyberagent_accepts_my365_app_sets_up_sirokhttp://www.japancorp.net/press_release/24696/cyberagent_accepts_my365_app_sets_up_sirokCyberAgent has accepted the "My365" SNS Application Service for iPhone, and has established Sirok Inc. as its smartphone app developer arm.Fri,6 Jan 2012 12:28:36 +0000http://www.japancorp.net/press_release/24686/ntt_data_group_acquires_stake_in_accellencehttp://www.japancorp.net/press_release/24686/ntt_data_group_acquires_stake_in_accellenceNTT DATA has acquired 51.4% of shares of Accellence, a company focused on the development of card business processing systems for financial institutions in Thailand.Tue,3 Jan 2012 10:45:24 +0000http://www.japancorp.net/press_release/24682/furukawa_develops_highstrength_copper_alloy_strip_for_ultracompact_connectorshttp://www.japancorp.net/press_release/24682/furukawa_develops_highstrength_copper_alloy_strip_for_ultracompact_connectorsFurukawa Electric has developed a high-strength copper Corson alloy strip called EFCUBE-ST, which is targeted for use as electrical contact materials in ultra-compact connectors mounted on thin electronic devices.Fri,30 Dec 2011 11:00:15 +0000